Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
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Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Vare #: 228106567

Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel

Vare #: 228106567

DKK 104

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Bestil nu og få den omkring Sunday, September 20
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Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
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Hvad der skiller sig ud

Compact Design
This reballing stencil's compact size facilitates easy storage and portability, making it ideal for repair technicians who require efficiency without sacrificing functionality during mobile device repairs.
High-Quality Material
Crafted from durable stainless steel, this stencil ensures long-lasting use and precision, providing technicians with reliable tools that withstand repeated use for thorough and accurate component repairs.
Universal Compatibility
Designed for various phone IC chips, this stencil provides versatility in repairs, addressing a wide range of user needs and ensuring compatibility with most popular device models on the market.

Produktdetaljer

Shop Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel online at a best price in Danmark. B0GZVVW343
BrandEminchu
Included Componentsno
Unit Count1.0 count
Country of OriginChina
ManufacturerEminchu
Model NumberEminchu8g43mcizpy (2141.2 cm)
Part NumberEminchu8g43mcizpy (2141.2 cm)
Item Weight1 lbs (450 grams)

Hvem bør købe?

Suitable For
  • Mobile Repair Technicians

    Ideal for technicians specializing in mobile repairs, needing precise stencil tools for effective BGA reballing tasks.

  • DIY Electronics Enthusiasts

    Great for hobbyists looking to perform advanced repairs on smartphones, enhancing their skills with professional tools.

  • Small Repair Shops

    Perfect for small repair shops wanting compact and efficient reballing solutions to improve workflow and service quality.

Not Suitable For
  • Mass Production Facilities

    Not suitable for high-volume production environments requiring automation and large-scale reballing equipment.

Produktbeskrivelse

Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel

Har du spørgsmål? Chat med os

Kundespørgsmål og svar

  • spørgsmål: What pitch options does the stencil offer?

    svar: The stencil offers four pitch options: 0.3mm, 0.35mm, 0.375mm, and 0.4mm.
  • spørgsmål: Is the stencil easy to transport?

    svar: Yes, the compact and elegant design makes it portable and easy to use.
  • spørgsmål: What materials is the stencil made from?

    svar: The stencil is made from premium stainless steel, ensuring durability and longevity.

Eminchu Templates Eminchu8g43mcizpy (2141.2 cm) Editorial Review

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DKK 104

Bestil nu og få den omkring Sunday, September 20

QTY:

Sikker transaktionSikker transaktion

PCI DSS-kompatibel og ISO 27001:2022-certificeret, med krypteret betaling og fuld køberbeskyttelse på hver ordre

Vores bedste logistikpartnere
  • fedex
  • dhl
Hurtigste grænseoverskridende levering

Egenskaber og fordele

  • Four pitch options for versatile and accurate soldering.
  • Fast and precise tin implantation without displacement.
  • Elegant, compact, and portable design for easy use.
  • Compatible with a variety of common IC chips.
  • Crafted from durable stainless steel for long-term reliability.
  • Ideal for efficient BGA IC chip repair.

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